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BASF – New organic semiconductor materials

BASF New Business presented its new semiconductor inks with versatile uses. Researchers at BASF have succeeded in improving the composition of the individual semiconductor ink components to double the mobility of the charge carriers in the printed circuits. The printing inks are based on semiconducting polymers featuring good solubility allowing easy adjustment of viscosity.

 

Brewer Science – Printed electronics sensors

The technical team at Brewer Science showcased new sensor technology featuring Brewer Science devices. The company demonstrated its printed flex sensors via an interactive robotic arm display as well as its newest printed electronic sensor device technologies.

 

CHASM – New CNT manufacturing process

AgeNT from CHASM utilizes a manufacturing process called “Print & Wipe” (patents pending), which is highly scalable for mass production with low capital investment. The AgNW coating is specially designed to have good “dry” adhesion, but poor “wet” adhesion. A proprietary CNT ink designed to provide high “wet and dry” adhesion is used.

 

DuPont – New thermal management material solutions

DuPont Electronic Materials showcase their new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.

 

Gooee – Smaller sensors for IoT

Gooee, the original ‘Full-Stack’, smart lighting ecosystem provider, has created the world’s smallest sensor for LED lighting and the Internet of Things (IoT) that now includes the latest Artificial Eye technology following an exclusive agreement with DELTA Microelectronics, a European leader in fabless ASIC design, sensor systems, lighting and optics.

 

Henkel – New silver ink materials

Henkel Adhesive Technologies demonstrated its strong focus on material solutions for printed electronics. Decades of formulation expertise have resulted in brand new LOCTITE highly conductive silver ink materials and inks to build force sensors, which are important developments for enabling next-generation printed electronics applications.

 

IKONICS  - Surface improvement materials

Alpha FlexTrace, sold through IKONICS Chromaline Screen Print Products division, showed a flexible, printed circuit substrate featuring a proprietary surface treatment that overcomes conductive ink spread, which is common in micro-circuit printing. The advanced surface properties of Alpha FlexTrace were developed by IKONICS to improve the print acuity of conductive pastes by maximizing ink deposit and controlling the circuit footprint at the substrate level.

 

KIWO – Materials for fine strucuture printing

KIWO displayed KIWOMASK UV 877 a screen-printable, UV-curable resist with high mechanical resistance for selective brushing of metal surfaces. Its excellent printing properties enable the sharply-contoured printing of the finest structures.

 

MacDermid Performance Solutions – New materials

MacDermid Performance Solutions, a division of Platform Specialty Products Corporation, announced a suite of materials and solutions serving the printed electronics industry.

 

MIRWEC Film Inc – Installation of a test coater

Yasui Seiki Japan has installed a new 700 mm wide test coater at its subsidiary, MIRWEC Film, Inc. in Bloomington, Indiana in October 2016. The IS700 test coater offers higher generation MICROGRAVURETM and slot die coating methods, with a high efficiency clean dryer.

 

Nanotronics – Advanced inspection system

Nanotronics demonstrated the world’s most advanced material agnostic inspection system. The company automate industrial microscopes used for inspection of the world’s smallest technologies: semiconductors, microchips, hard drives, LEDs, nano-fillers, nanotubes, and more.

 

N.C. State – Textile capabilities

N.C. State was onsite discussing their work and research as well as showing the testing, fabrication and prototyping capabilities offered by the Zeis Textiles Extension and the renowned Textile Protection and Comfort Center (T-PACC).

 

NuMetal – Copper ink solutions

NuMetal-Cu is the first in a family of nanometal solutions being introduced by ZeroValent NanoMetals. NuMetal-Cu targets applications where there is a desire to print circuitry onto a diverse set of substrate materials such as glass, film substrates, paper and fabric at low temperatures.

 

Pavegen – Higher power energy harvesting solution

The new Pavegen technology, known as V3, is sleeker and more efficient than before, generating over 200 times more power than the first model manufactured in 2009. Pavegen technology is focusing on floor, energy and data, whilst shifting its focus from kinetic-only vision into smart floors and the business of data.

 

SecureRF – Secure IoT sensors

SecureRF demonstrated the latest versions of its LIMETM Tags, a line of secure IoT sensors, tags, smartcards and connectivity platforms. These devices all have integrated authentication and security features and offer a modular design that allows users to easily and quickly assemble the solution they need.

 

Sefar – High-quality mesh screens

Sefar Inc. displayed both high-quality mesh and high-quality screens designed to meet specific customer needs. The extensive product range includes pre-stretched screens, pre-sensitized or coated screens and imaged screens.

 

Sensoria – Training software for Sensoria wearables

Sensoria Inc., a world leader in wearable fitness and smart garment technology, demonstrated and announced the availability of its Sensoria Run v2.0 Beta app and Sensoria Web Dashboard v2.0 Beta at the show. The app, which features new training plans and is now available in beta as a free download for iOS devices, works with Sensoria’s smart garments to provide real-time audio and visual feedback via Sensoria’s Artificial Intelligence Coach, Mara.

 

Xenon – Launch of benchtop R&D system

ENON Corporation introduced the industry’s lowest cost benchtop R&D system, the XENON X-1100, at the conference. The X-1100 features programmable pulse parameters providing operator setup flexibility that enables researchers, scientists and engineers to more easily characterize new processes using XENON's proven technology.

 

For the latest news on emerging technologies keep reading www.idtechex.com.

 

Source: IDTechEx

From the exhibition hall at the IDTechEx Show! in Santa Clara, Calif., last week came a wide variety of new product announcements and press releases. Here we summarize some of the announcements:

 

ACEO – 3D printed silicone material

The ACEO team from WACKER presented their 3D printing with silicones technology to the American market. The drop-on-demand technology, a milestone in additive manufacturing, combines high precision and freedom in design.

 

ACREO – Installs new inkjet platform

ACREO have designed a high-end CeraPrinter F-Serie platform (from Ceradrop, who were also exhibiting), that allows the players to achieve the targeted results in advanced R&D.

 

Adphos – 3D curing

The adphos Group showcased it newest solution for the printed electronics market: a high density light focusing system that delivers near laser-like performance at a fraction of the price. Designed to dry, cure and “pin” material for 3D and direct to shape printing applications, the MicroSpot 3D puts radiant energy exactly where needed.

 

alpha Assembly Solutions – New materials

Alpha Assembly Solutions featured product technologies that serve the flexible, formable & printed electronics market in the form of low temperature solder paste, electronic adhesives (thermal & UV curable), sintered materials, conductive inks and dielectrics and encapsulants for the printed electronics market. ‟We are introducing a robust portfolio of new products and technologies developed specifically to meet the demanding performance and reliability requirements of flexible and printed electronic circuits,” said Bawa Singh, EVP of Technology and Corporate Development for Alpha.

 

Analog Devices – MEMs sensors for vibration measurement

Analog Devices, Inc. (ADI) announced three-axis, MEMS accelerometers that perform high-resolution vibration measurement with very low noise to enable the early detection of structural defects via wireless sensor networks. The low power consumption of the new ADXL354 and ADXL355 accelerometers extends battery life and allows extended product usage by reducing the time between battery changes.

 

Applied Graphene Materials – Shipping first production orders

Applied Graphene Materials (AGM) has started to supply first production orders to customers within its target composites, polymers and coatings industries. An independent test programme investigating the addition of Applied Graphene Materials (AGM) graphene nanoplatelets (A-GNPs) to epoxy coatings, has shown outstanding performance enhancements across industry ISO standard anti-corrosion and barrier tests.

New products unveiled at California show

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